Anisotropic Conductive Film (ACF) lamination applies a structured conductive adhesive tape onto the designated Lead-In Terminals (LIT) of the TFT glass. The film contains millions of microscopic conductive particles (gold-coated polymer spheres) suspended in an insulating epoxy matrix, designed to provide vertical electrical conduction (Z-axis) while maintaining absolute electrical insulation in the horizontal (X/Y-axis) plane.
Maxen utilizes Fully Automated Reel-to-Reel ACF Pre-Lamination Modules equipped with Constant-Heat and Fast-Ramp Pulse-Heat Tool Heads. The equipment features independent Digital Pressure Transducers and Inline Infrared Thermal Imagers to track heat dissipation.
Tape feeding, precision alignment, vacuum clamping, cutting, and localized pre-pressing are completed in 2.5 to 4.0 seconds per terminal edge.
To accommodate ultra-fine pitch trends (<20 μm spacing for high-resolution displays), Maxen is upgrading to Dual-Layer ACF Film Feeding Structures that separate the captive particle layer from the adhesive base. Our Kaizen target is a zero-bubble lamination matrix via optimized constant-vacuum buffering shoes. This will reduce raw ACF material waste by 8% and support the production of ultra-narrow bezel smart displays.