TFT LCD display production process step 1 – Glass Cutting – Precision Starts Here

Purpose:

This initial process segments large-format mother glass sheets (such as Generation 4.5 or Gen 5 substrates) into individual, customized TFT LCD panel matrices. It establishes the foundational physical dimensions, eliminates micro-fractures along the perimeter, and prepares the edge geometry to withstand high mechanical stresses in downstream assembly and final product applications.

Process Characteristics & Equipment:

Maxen Electronics operates a fully automated line centered around High-Precision CNC Laser Scribing Systems integrated with Diamond-Wheel Mechanical Scribing Units (e.g., Mitsuboshi Diamond Grid cutters). The system utilizes Dual-CCD High-Resolution Vision Cameras for automatic fiducial alignment. Metrology is governed by Non-Contact Laser Displacement Sensors and Keyence Digital Microscope Systems to inspect edge quality.

• Technical Precision: Achieves a cutting tolerance of ±0.01mm, a perpendicularity error of less than 0.02mm, and controls micro-chipping depth to <5 μm.

Factory Processing Time:

The cycle time is highly optimized, requiring 6 to 12 seconds per sheet for cutting, followed by a 4-second automated pneumatic breakout and transport sequence via ESD-safe robotic arms.

Continuous Improvement (Kaizen) & Vision:

To eliminate micro-stress entirely, Maxen is transitioning from mechanical wheel scribing to Picosecond Ultra-Short Pulse Cold-Laser Cutting technology. Our continuous improvement initiative focuses on reducing the edge-roughness (Ra) value from 0.8 μm down to <0.2 μm. This eliminates secondary mechanical chamfering and grinding stages, increasing raw material yield by 1.8% and boosting the drop-test resistance of the finished panel by 25%.